About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Atomic layer controlled deposition of silicon nitride with self-limiting mechanism

Type:
Journal
Info:
Appl. Phys. Lett. 68, 3257 (1996)
Date:
1996-03-28

Author Information

Name Institution
Hiroshi GotoHiroshima University
Kentaro ShibaharaHiroshima University
Shin YokoyamaHiroshima University

Films

Plasma SiNx

Hardware used: Unknown


CAS#: 7664-41-7

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Substrates

Unknown

Notes

73