About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Microwave remote plasma enhanced-atomic layer deposition system with multicusp confinement chamber

Type:
Journal
Info:
REVIEW OF SCIENTIFIC INSTRUMENTS 85, 103510 (2014)
Date:
2014-10-09

Author Information

Name Institution
A. DechanaSongkhla Rajabhat University
P. ThamboonChiang Mai University
Dheerawan BoonyawanChiang Mai University

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Electron Density, ne
Analysis: Langmuir Probe

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Substrates

SiO2

Notes

Plasma characteristics and PEALD Al2O3 demonstration on custom microwave plasma ALD system.
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