About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Atomic layer deposition of silicon-based dielectrics for semiconductor manufacturing: Current status and future outlook

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 37, 060904 (2019)
Date:
2019-08-22

Author Information

Name Institution
Rafaiel A. OvanesyanColorado School of Mines
Ekaterina A. FilatovaTyndall National Institute, University College Cork
Simon D. ElliottSchrödinger
Dennis M. HausmannLam Research Corporation
David C. SmithLam Research Corporation
Sumit AgarwalColorado School of Mines

Films

Plasma SiO2

Hardware used: Unknown


Plasma SiNx

Hardware used: Unknown


Plasma SiC

Hardware used: Unknown


Film/Plasma Properties

Substrates

Notes

Review paper
1645