About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Surface engineering of nanoporous substrate for solid oxide fuel cells with atomic layer-deposited electrolyte

Type:
Journal
Info:
Beilstein J. Nanotechnol. 2015, 6, 1805--1810
Date:
2015-08-09

Author Information

Name Institution
Sanghoon JiSeoul National University
Waqas Hassan TanveerSeoul National University
Wonjong YuSeoul National University
Sungmin KangKorea Advanced Institute of Science and Technology
Gu Young ChoSeoul National University
Sung Han KimSamsung Electronics Co.
Jihwan AnSeoul National University of Science and Technology
Suk Won ChaSeoul National University

Films


Film/Plasma Properties

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Microstructure
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Substrates

AAO, Anodic Aluminum Oxide

Notes

395