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Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics

Type:
Journal
Info:
APPLIED PHYSICS LETTERS 101, 093702 (2012)
Date:
2012-08-14

Author Information

Name Institution
Xianzong XieUniversity of Utah
Loren RiethUniversity of Utah
Srinivas MeruguUniversity of Utah
Prashant TathireddyUniversity of Utah
Florian SolzbacherUniversity of Utah

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Substrates

Silicon
Ti
Pt
Au
SiO2

Notes

Ultratech Fiji PEALD Al2O3 for biomedical implant encapsulation.
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