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Spectral analysis of sidewall roughness during resist-core self-aligned double patterning integration

Type:
Journal
Info:
Journal of Vacuum Science & Technology B 34, 051807 (2016)
Date:
2016-08-25
DOI:
http://dx.doi.org/10.1116/1.4962322

Author Information

Name Institution
E. DupuyGrenoble Alps University (UGA)
E. PargonGrenoble Alps University (UGA)
M. FouchierGrenoble Alps University (UGA)
H. GrampeixCEA - Grenoble
J. PradellesCEA - Grenoble

Films

Plasma SiO2

Hardware used: ASM EmerALD
BDEAS, SAM-24, Bis(diethylamino)silane, (Et2N)2SiH2
CAS#: 27804-64-4
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 50C

Film/Plasma Properties

Substrates

Photoresist
TOK CAP64, Positive Chemically Amplified Photoresist
ARC, Antireflective Coating

Notes

906