Plasma enhanced atomic layer deposition of HfO2 and ZrO2 high-k thin films
Info:
J. Vac. Sci. Technol. A 23(3), May/Jun 2005
Author Information
Films
Film/Plasma Properties
Analysis: OES, Optical Emission Spectroscopy
Analysis: Spectrophotometry
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: AFM, Atomic Force Microscopy
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: I-V, Current-Voltage Measurements
Substrates
Notes
| Silicon samples DI rinsed and HF cleaned. |
| Deposition temperature not mentioned. Cold wall reactor. Perhaps related to high ZrO2 GPC. |
| Results compared to PECVD results from their earlier publication. |
| Some samples annealed at 250C in air. |
| 63 |