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Impact of interface materials on side permeation in indirect encapsulation of organic electronics

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 38, 033203 (2020)
Date:
2020-02-20
DOI:
http://dx.doi.org/10.1116/1.5140665

Author Information

Name Institution
Ankit Kumar SinghGeorgia Institute of Technology
Wen-Fang ChouGeorgia Institute of Technology
Xiaojia JiaGeorgia Institute of Technology
Cheng-Yin WangGeorgia Institute of Technology
Canek Fuentes-HernandezGeorgia Institute of Technology
Bernard KippelenGeorgia Institute of Technology
Samuel GrahamGeorgia Institute of Technology

Films

Plasma Al2O3

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 100C

Plasma TiO2

Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
TDMATi, tetrakis(dimethylamido)titanium, titanium dimethylamide, (Me2N)4Ti
CAS#: 3275-24-9
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 100C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000

Characteristic: Wetting Angle
Analysis: Contact Angle Measurement
Diagnostic: Ramé-Hart 250

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test
Diagnostic: Custom

Substrates

PEN, Polyethylene Napthalate
Silicon

Notes

1464