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The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Top-down fabrication of fluorine-doped tin oxide nanopillar substrates for solar water splitting

Type:
Journal
Info:
RSC Adv., 2017, 7, 28350-28357
Date:
2017-05-08

Author Information

Name Institution
Maureen H. TangDrexel University
Pongkarn ChakthranontStanford University
Thomas F. JaramilloStanford University

Films

Plasma WO3


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Optical Absorption
Analysis: UV-VIS Spectroscopy

Substrates

FTO, F:SnO2

Notes

1133