About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Process Control of Atomic Layer Deposition Molybdenum Oxide Nucleation and Sulfidation to Large-Area MoS2 Monolayers

Type:
Journal
Info:
Chem. Mater. 2017, 29, 2024-2032
Date:
2017-02-03

Author Information

Name Institution
Brent D. KellerMIT
Adam BertuchCambridge NanoTech
J ProvineStanford University
Ganesh M. SundaramCambridge NanoTech
Nicola FerralisMIT
Jeffrey C. GrossmanMIT

Films

Thermal MoOx


Plasma MoOx


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Nucleation
Analysis: AFM, Atomic Force Microscopy

Substrates

Silicon
SiO2

Notes

1023