About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Evaluation of NbN thin films grown by MOCVD and plasma-enhanced ALD for gate electrode application in high-k/SiO2 gate stacks

Type:
Journal
Info:
Semicond. Sci. Technol. 25 (2010) 045009
Date:
2010-02-23
DOI:
http://dx.doi.org/10.1088/0268-1242/25/4/045009

Author Information

Name Institution
J. HinzFraunhofer Institute for Integrated Systems and Device Technology (IISB)
Anton J. BauerFraunhofer Institute for Integrated Systems and Device Technology (IISB)
T. ThiedeRuhr-University Bochum
Roland A. FischerRuhr-University Bochum
L. FreyFraunhofer Institute for Integrated Systems and Device Technology (IISB)

Films

Plasma NbN

Hardware used: Unknown
Nb(N-tBu)(NMeEt)3, TBTMEN
CAS#: 864150-47-0
Unknown
CAS#: Unknown
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: SNMS, Seconday Neutral Mass Spectrometry
Diagnostic: -

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Work Function
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Fixed Charge
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: -

Characteristic: Work Function
Analysis: I-V, Current-Voltage Measurements
Diagnostic: -

Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements
Diagnostic: -

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Diagnostic: -

Substrates

SiO2
HfO2

Notes

Some samples RTP at 900C for 30s.
Plasma gas not mentioned. Might be in companion paper http://dx.doi.org/10.1088/0268-1242/25/7/075009.
60