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Enhancement of barrier properties of aluminum oxide layer by optimization of plasma-enhanced atomic layer deposition process

Type:
Journal
Info:
Thin Solid Films 534 (2013) 515 - 519
Date:
2013-02-25
DOI:
http://dx.doi.org/10.1016/j.tsf.2013.02.125

Author Information

Name Institution
Jong Geol LeeKyung Hee University
Hyun Gi KimKyung Hee University
Sung Soo KimKyung Hee University

Films

Plasma Al2O3

Hardware used: Unknown
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 120C

Film/Plasma Properties

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Water Vapor Transmission Rate (WVTR)
Diagnostic: Mocon PERMATRAN-W Model 3/33

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test
Diagnostic: Custom

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam VASE

Characteristic: Refractive Index
Analysis: Ellipsometry
Diagnostic: J.A. Woollam VASE

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Thermo Scientific K-Alpha

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Digital Instruments Nanoscope III

Substrates

PEN, Polyethylene Napthalate

Notes

567