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Composition, structure, and electrical characteristics of HfO2 gate dielectrics grown using the remote- and direct-plasma atomic layer deposition methods

Type:
Journal
Info:
Journal of Applied Physics 98, 094504 (2005)
Date:
2005-09-23

Author Information

Name Institution
Jinwoo KimHanyang University
Seokhoon KimHanyang University
Hyunseok KangHanyang University
Jihoon ChoiHanyang University
Hyeongtag JeonHanyang University
Mannho ChoKorea Research Institute of Standards and Science (KRISS)
Kwunbum ChungKorea Research Institute of Standards and Science (KRISS)
Sungkwun BackGwanju Institute of Science and Technology (GIST)
Kyungdong YooHynix Semiconductor
Choelhwyi BaeNorth Carolina State University

Films


Plasma HfO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: MEIS, Medium Energy Ion Scattering

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Effective Oxide Charge, Qeff
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Transistor Characteristics
Analysis: Transistor Characterization

Substrates

Si(100)

Notes

1244