About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Localized dielectric breakdown and antireflection coating in metal-oxide-semiconductor photoelectrodes

Type:
Journal
Info:
Nature Materials volume 16, pages 127-131 (2017)
Date:
2016-11-07

Author Information

Name Institution
Li JiUniversity of Texas at Austin
Hsien-Yi HsuUniversity of Texas at Austin
Xiaohan LiUniversity of Texas at Austin
Kai HuangUniversity of Texas at Austin
Ye ZhangUniversity of Texas at Austin
Jack C. LeeUniversity of Texas at Austin
Allen J. BardUniversity of Texas at Austin
Edward T. YuUniversity of Texas at Austin

Films

Plasma SiO2


Film/Plasma Properties

Characteristic: Current Density
Analysis: Linear Sweep Voltammetry

Characteristic: Efficiency
Analysis: IPCE, Incident-Photon-to-Current Conversion Efficiency

Substrates

Notes

1154