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Nanoscopic structural rearrangements of the Cu-filament in conductive-bridge memories

Type:
Journal
Info:
Nanoscale 2016, Volume 8, Issue 29, pp 13915-13923
Date:
2016-01-24
DOI:
http://dx.doi.org/10.1039/C5NR08735J

Author Information

Name Institution
U. CelanoKU Leuven
G. GiammariaKU Leuven
L. GouxIMEC
A. BelmonteKU Leuven
M. JurczakKU Leuven
Wilfried VandervorstKU Leuven

Films

Plasma Al2O3

Hardware used: Unknown
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 45C

Film/Plasma Properties

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: -

Substrates

Cu

Notes

761