About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Nanoscopic structural rearrangements of the Cu-filament in conductive-bridge memories

Type:

Journal

Info:

Nanoscale 2016, Volume 8, Issue 29, pp 13915-13923

Date:

2016-01-24

DOI:

http://dx.doi.org/10.1039/C5NR08735J

Author Information

Name	Institution
U. Celano	KU Leuven
G. Giammaria	KU Leuven
L. Goux	IMEC
A. Belmonte	KU Leuven
M. Jurczak	KU Leuven
Wilfried Vandervorst	KU Leuven

Films

Plasma Al₂O₃

Hardware used: Unknown

TMA, Trimethylaluminum, Trimethylalumane, AlMe₃, Al(CH₃)₃

CAS#: 75-24-1

O₂, Oxygen

CAS#: 7782-44-7

Deposition Temperature = 45C

Film/Plasma Properties

Characteristic: Images

Analysis: TEM, Transmission Electron Microscope

Diagnostic: -

Characteristic: Morphology, Roughness, Topography

Analysis: AFM, Atomic Force Microscopy