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The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Optimization of the Silver Nanoparticles PEALD Process on the Surface of 1-D Titania Coatings

Type:
Journal
Info:
Nanomaterials 2017, 7, 193
Date:
2017-07-20

Author Information

Name Institution
Aleksandra RadtkeNicolaus Copernicus University in Toruń
Tomasz JędrzejewskiNicolaus Copernicus University in Toruń
Wiesław KozakNicolaus Copernicus University in Toruń
Beata SadowskaUniversity of Lodz
Marzena Więckowska-SzakielUniversity of Lodz
Ewa TalikUniversity of Silesia
Maarit MäkeläUniversity of Helsinki
Markku A. LeskeläUniversity of Helsinki
Piotr PiszczekNicolaus Copernicus University in Toruń

Films


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Substrates

TiO2

Notes

1110