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Plasma-Enhanced ALD of TiO2 Thin Films on SUS 304 Stainless Steel for Photocatalytic Application

Type:
Journal
Info:
Journal of The Electrochemical Society, 156 (5) D188-D192 (2009)
Date:
2009-02-09
DOI:
http://dx.doi.org/10.1149/1.3095515

Author Information

Name Institution
Changsoo LeePohang University of Science and Technology (POSTECH)
Jungwon KimPohang University of Science and Technology (POSTECH)
J. Y. SonPohang University of Science and Technology (POSTECH)
Wan Joo MaengPohang University of Science and Technology (POSTECH)
Du-Hwan JoPOSCO
Wonyong ChoiPohang University of Science and Technology (POSTECH)
Hyungjun KimPohang University of Science and Technology (POSTECH)

Films

Plasma TiO2

Hardware used: Custom
TDMATi, tetrakis(dimethylamido)titanium, titanium dimethylamide, (Me2N)4Ti
CAS#: 3275-24-9
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range = 150-400C

Film/Plasma Properties

Characteristic: Self Cleaning
Analysis: Contact Angle Measurement
Diagnostic: -

Characteristic: Self Cleaning
Analysis: Organic Compound Decomposition
Diagnostic: -

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: -

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: -

Substrates

SUS 304 Stainless Steel
Si(001)

Notes

751