About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Flexible Al2O3/plasma polymer multilayer moisture barrier films deposited by a spatial atomic layer deposition process

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 38, 022418 (2020)
Date:
2020-02-03

Author Information

Name Institution
Sun Jung KimSungkyunkwan University
Sang Heon YongSungkyunkwan University
You Jin ChoiSungkyunkwan University
Hyeok HwangboSungkyunkwan University
Woo-Young YangSamsung Advanced Institute of Technology
Heeyeop ChaeSungkyunkwan University

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Transmittance
Analysis: UV-VIS Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Substrates

PEN, Polyethylene Napthalate
Si(100)

Notes

1460