Area selective deposition of TiO2 by intercalation of plasma etching cycles in PEALD process: A bottom up approach for the simplification of 3D integration scheme
Info:
Journal of Vacuum Science & Technology A 37, 020918 (2019)
Author Information
Films
Film/Plasma Properties
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: AFM, Atomic Force Microscopy
Analysis: SEM, Scanning Electron Microscopy
Substrates
Notes