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Hydrogen-plasma-assisted hybrid atomic layer deposition of Ir thin film as novel Cu diffusion barrier

Type:
Journal
Info:
Surface & Coatings Technology 211 (2012) 14-17
Date:
2011-10-08
DOI:
https://doi.org/10.1016/j.surfcoat.2011.09.074

Author Information

Name Institution
Sang In SongKorea Institute of Industrial Technology
Jong Ho LeeKorea Institute of Industrial Technology
Bum Ho ChoiKorea Institute of Industrial Technology
Hong Kee LeeKorea Institute of Industrial Technology
Dong Chan ShinChosun University
Jin-Wook LeeLeintec Co., Ltd

Films

Plasma Ir

Hardware used: Unknown
(ethylcyclopentadienyl) (1, 5-cyclooctodiene) Iridium, Ir(EtCp)(COD)
CAS#: 0-0-0
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 330C

Film/Plasma Properties

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Tecnai G2 F30

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Tecnai G2 F30

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: FEI Quanta 200 FEG

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: PSIA XE-200

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: PANalytical Xpert PRO MRD X-ray Diffractometer

Substrates

Si(100)

Notes

Not really ALD. Ir precursor mixed with H2 gas during plasma step.
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