Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2015, 7 (31), pp 17032-17043
Date:
2015-07-21

Author Information

Name Institution
Albena PaskalevaBulgarian Academy of Sciences
Mathias RommelFraunhofer Institute for Integrated Systems and Device Technology (IISB)
Andreas HutzlerFriedrich-Alexander University Erlangen-Nuremberg
Dencho SpassovBulgarian Academy of Sciences
Anton J. BauerFraunhofer Institute for Integrated Systems and Device Technology (IISB)

Films

Plasma HfO2



Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Fixed Charge
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Leakage Current
Analysis: Temperature Dependent I-V, Current-Voltage Measurements

Substrates

SiOxNy

Notes

408