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Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2015, 7 (31), pp 17032-17043
Date:
2015-07-21

Author Information

Name Institution
Albena PaskalevaBulgarian Academy of Sciences
Mathias RommelFraunhofer Institute for Integrated Systems and Device Technology (IISB)
Andreas HutzlerFriedrich-Alexander University Erlangen-Nuremberg
Dencho SpassovBulgarian Academy of Sciences
Anton J. BauerFraunhofer Institute for Integrated Systems and Device Technology (IISB)

Films

Plasma HfO2



Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Fixed Charge
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Leakage Current
Analysis: Temperature Dependent I-V, Current-Voltage Measurements

Substrates

SiOxNy

Notes

408