About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

A New Hole Transport Material for Efficient Perovskite Solar Cells With Reduced Device Cost

Type:
Journal
Info:
Sol. RRL 2018, 2, 1700175--n/a
Date:
2017-11-22

Author Information

Name Institution
Yuhao SunNanjing University of Science and Technology
Changlei WangUniversity of Toledo
Dewei ZhaoUniversity of Toledo
Jiangsheng YuNanjing University of Science and Technology
Xinxing YinNanjing University of Science and Technology
Corey R. GriceUniversity of Toledo
Rasha A. AwniUniversity of Toledo
Niraj ShresthaUniversity of Toledo
Yue YuUniversity of Toledo
Lei GuanUniversity of Toledo
Randy J. EllingsonUniversity of Toledo
Weihua TangNanjing University of Science and Technology
Yanfa YanUniversity of Toledo

Films

Plasma SnO2


Film/Plasma Properties

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Substrates

FTO, F:SnO2

Notes

1060