About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Cost-effective hole transporting material for stable and efficient perovskite solar cells with fill factors up to 82%

Type:
Journal
Info:
J. Mater. Chem. A, 2017, 5, 23319-23327
Date:
2017-10-09

Author Information

Name Institution
Lei GuanWuhan University
Xinxing YinNanjing University of Science and Technology
Dewei ZhaoUniversity of Toledo
Changlei WangUniversity of Toledo
Qiaoshi AnBeijing Jiaotong University
Jiangsheng YuNanjing University of Science and Technology
Niraj ShresthaUniversity of Toledo
Corey R. GriceUniversity of Toledo
Rasha A. AwniUniversity of Toledo
Yue YuUniversity of Toledo
Zhaoning SongUniversity of Toledo
Jie ZhouNanjing University of Science and Technology
Weiwei MengUniversity of Toledo
Fujun ZhangBeijing Jiaotong University
Randy J. EllingsonUniversity of Toledo
Jianbo WangWuhan University
Weihua TangNanjing University of Science and Technology
Yanfa YanUniversity of Toledo

Films

Plasma SnO2


Film/Plasma Properties

Substrates

FTO, F:SnO2

Notes

1058