About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Large area photoelectrodes based on hybrids of CNT fibres and ALD-grown TiO2

Type:
Journal
Info:
J. Mater. Chem. A, 2017
Date:
2017-11-03

Author Information

Name Institution
Alicia MoyaIMDEA Materials
Nina KemnadeTechnische Universität Wien
Manuel R. OsorioIMDEA Nanoscience
Alexey S CherevanTechnische Universität Wien
Daniel GranadosIMDEA Materials
Dominik EderTechnische Universität Wien
Juan VilatelaIMDEA Materials

Films



Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Raman Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Work Function
Analysis: UPS, Ultraviolet Photoemission Spectroscopy

Characteristic: Electrochemical Performance
Analysis: Custom

Substrates

CNTs, Carbon NanoTubes

Notes

1028