Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


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Jiajun Mao Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Jiajun Mao returned 3 record(s).

NumberTitle
1Copper-ALD Seed Layer as an Enabler for Device Scaling
2Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
3PEALD of Copper using New Precursors for Next Generation of Interconnections