Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Bis(N,N'-di-sec-butylacetamidinato)dicopper(I), copper(I)-N,N'-di-sec-butylacetamidinate, CAS# 695188-31-9

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 2 record(s).

NumberTitle
1Plasma-Enhanced Atomic Layer Deposition of p-Type Copper Oxide Semiconductors with Tunable Phase, Oxidation State, and Morphology
2Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides