Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Abacus, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 4 record(s).

NumberTitle
1PEALD of Copper using New Precursors for Next Generation of Interconnections
2Copper-ALD Seed Layer as an Enabler for Device Scaling
3Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
4Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD