Cu(TMHD)2, Cu(THD)2, bis(2,2,6,6-tetramethyl-3,5-heptanedionate) copper, Copper(II) dipivaloylmethanate, CAS# 14040-05-2
Plasma Enhanced Atomic Layer Deposition Film Publications
Your search for publications using this chemistry returned 2 record(s).
| Number | Title |
|---|---|
| 1 | Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces |
| 2 | Radical Enhanced Atomic Layer Deposition of Metals and Oxides |