bis(tert-butylimido)bis(bis(trimethylsilylamido))tungsten(VI), [W(N^tBu)₂{N(SiMe₃)₂}₂], CAS# 0-0-0

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Number	Title
1	Highly-Conformal Amorphous W-Si-N Thin Films by Plasma Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization

bis(tert-butylimido)bis(bis(trimethylsilylamido))tungsten(VI), [W(NtBu)2{N(SiMe3)2}2], CAS# 0-0-0