Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

copper(II) hexafluoroacetylacetonate, Cu(HFAC)2, CAS# 155640-85-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 2 record(s).

NumberTitle
1Carbon nanotube-supported Cu3N nanocrystals as a highly active catalyst for oxygen reduction reaction
2Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy