Cuprum, CAS# 0-0-0
Plasma Enhanced Atomic Layer Deposition Film Publications
Your search for publications using this chemistry returned 2 record(s).
| Number | Title |
|---|---|
| 1 | PEALD of Copper using New Precursors for Next Generation of Interconnections |
| 2 | Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD |