Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


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Ethylmethylruthenocene, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 1 record(s).

NumberTitle
1Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers