Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
2Pegasus ChemicalsπŸ‡¬πŸ‡§Bis(ethylcyclopentadienyl)ruthenium
3DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium
4Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
6GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
2Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
3Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
4Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
5Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
6Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
7Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
8Ru thin film grown on TaN by plasma enhanced atomic layer deposition
9ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
10Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
11A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
12Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
13The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
14Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
15Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
16(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
17Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
18In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
19Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
20PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
21Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
22Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
23Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
24Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
25Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
26Texture of atomic layer deposited ruthenium
27Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
28Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
29Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
30Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
31Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
32Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
33In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
34Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
35Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
36Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
37Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals