Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorLink
1Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
2Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
3Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 24 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberCompositionTitle
1RuAtomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
2RuCorrelation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
3RuEffects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
4RuFormation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
5RuImprovement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
6RuIn Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
7RuPEALD of a Ruthenium Adhesion Layer for Copper Interconnects
8RuPlasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
9RuPreparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
10RuReliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
11RuRu thin film grown on TaN by plasma enhanced atomic layer deposition
12RuStructural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
13RuStructure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
14RuThe properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
15RuThermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
16RuNxIn Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
17RuO2ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
18RuO2Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
19RuO2Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
20RuO2Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
21RuO2Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
22RuO2Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
23RuTiNImproved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
24RuTiNPlasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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