WF6, Tungsten Hexafluoride, CAS# 7783-82-6

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 10 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

1WAtomic layer deposition of ultrathin platinum films on tungsten atomic layer deposition adhesion layers: Application to high surface area substrates
2WComparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
3WHot-wire assisted ALD of tungsten films: In-situ study of the interplay between CVD, etching, and ALD modes
4WCNPulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
5WNA New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
6WNEffects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
7WNInvestigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
8WNMethod to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
9WNPulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
10WO3Room temperature plasma enhanced atomic layer deposition for TiO2 and WO3 films


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