Publication Information

Title: Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

Type: Journal

Info: Surface and Coatings Technology, Volume 259, Part A, 25 November 2014, Pages 98-101

Date: 2014-05-15

DOI: http://dx.doi.org/10.1016/j.surfcoat.2014.05.005

Author Information

Name

Institution

Hanyang University

Films

Plasma Co using Custom

Deposition Temperature Range = 120-200C

56792-69-9

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Compositional Depth Profiling

AES, Auger Electron Spectroscopy

PHI 680 FEAES

Thickness

TEM, Transmission Electron Microscope

Hitachi HD-2300A

Wetting Angle

Contact Angle Measurement

Unknown

Wetting Angle

Sessile Drop Tests

Unknown

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Unknown

Substrates

TaN

Keywords

Copper Electroplating

Interconnect

Metallic Thin Films

Notes

PEALD Co for copper interconnect plating.

278

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