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Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
Type:
Journal
Info:
Surface and Coatings Technology, Volume 259, Part A, 25 November 2014, Pages 98-101
Date:
2014-05-15
Author Information
| Name | Institution |
|---|---|
| Jae-Hyung Park | Hanyang University |
Films
Film/Plasma Properties
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Wetting Angle
Analysis: Contact Angle Measurement
Characteristic: Wetting Angle
Analysis: Sessile Drop Tests
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Substrates
| TaN |
Notes
| PEALD Co for copper interconnect plating. |
| 278 |