Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
Type:
Journal
Info:
Journal of Alloys and Compounds, Volume 686, 2016, Pages 1025 - 1031
Date:
2016-06-27
Author Information
Name | Institution |
---|---|
Hyun-Jung Lee | Yeungnam University |
Tae Eun Hong | Korean Basic Science Institute |
Soo-Hyun Kim | Yeungnam University |
Films
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Substrates
SiO2 |
Notes
919 |