Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method

Type:
Journal
Info:
Jpn. J. Appl. Phys. Vol. 42 (2003) pp. L414-L416
Date:
2003-02-27

Author Information

Name Institution
Ju Youn KimHanyang University
Yangdo KimPusan National University
Hyeongtag JeonHanyang University

Films


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2

Notes

94