Publication Information

Title: ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects

Type: Journal

Info: ECS Transactions, 69 (7) 161-169 (2015)

Date: 2015-10-11

DOI: http://dx.doi.org/10.1149/06907.0161ecst

Author Information

Name

Institution

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

IBM

Films

Plasma TaNx using Unknown

Deposition Temperature Range N/A

Thermal TaNx using Unknown

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Keywords

Notes

418

Disclaimer

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