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Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics
Type:
Journal
Info:
APPLIED PHYSICS LETTERS 101, 093702 (2012)
Date:
2012-08-14
Author Information
| Name | Institution |
|---|---|
| Xianzong Xie | University of Utah |
| Loren Rieth | University of Utah |
| Srinivas Merugu | University of Utah |
| Prashant Tathireddy | University of Utah |
| Florian Solzbacher | University of Utah |
Films
Plasma Al2O3
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
| Silicon |
| Ti |
| Pt |
| Au |
| SiO2 |
Notes
| Ultratech Fiji PEALD Al2O3 for biomedical implant encapsulation. |
| 162 |