Publication Information

Title: Plasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronics

Type: Journal

Info: APPLIED PHYSICS LETTERS 101, 093702 (2012)

Date: 2012-08-14

DOI: http://dx.doi.org/10.1063/1.4748322

Author Information

Name

Institution

University of Utah

University of Utah

University of Utah

University of Utah

University of Utah

Films

Deposition Temperature = 120C

75-24-1

7782-44-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

Ellipsometry

J.A. Woollam VASE

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Unknown

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Kratos Analytical Axis Ultra DLD

Compositional Depth Profiling

XPS, X-ray Photoelectron Spectroscopy

Kratos Analytical Axis Ultra DLD

Leakage Current

I-V, Current-Voltage Measurements

Unknown

Substrates

Silicon

Ti

Pt

Au

SiO2

Keywords

Encapsulation

Biomedical Implant

Notes

Ultratech Fiji PEALD Al2O3 for biomedical implant encapsulation.

162

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