Low-Temperature Conformal Atomic Layer Deposition of SiNx Films Using Si2Cl6 and NH3 Plasma

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2015, 7 (20), pp 10806-10813
Date:
2015-04-30

Author Information

Name Institution
Rafaiel A. OvanesyanColorado School of Mines
Dennis M. HausmannLam Research Corporation
Sumit AgarwalColorado School of Mines

Films

Plasma SiNx

Hardware used: Custom


CAS#: 7664-41-7

Film/Plasma Properties

Characteristic: Bonding States
Analysis: ATR-FTIR

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: HFS, Hydrogen Forward Scattering

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Substrates

SiO2

Notes

355