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Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
Type:
Journal
Info:
Journal of Alloys and Compounds, Volume 663, 2016, Pages 651 - 658
Date:
2015-12-20
Author Information
| Name | Institution |
|---|---|
| Yujin Jang | Yeungnam University |
| Jun Beom Kim | Yeungnam University |
| Tae Eun Hong | Korean Basic Science Institute |
| So Jeong Yeo | Korea Research Institute of Chemical Technology |
| Sunju Lee | Korea Research Institute of Chemical Technology |
| Eun Ae Jung | Korea Research Institute of Chemical Technology |
| Bo Keun Park | Korea Research Institute of Chemical Technology |
| Taek-Mo Chung | Korea Research Institute of Chemical Technology |
| Chang Gyoun Kim | Korea Research Institute of Chemical Technology |
| Do-Joong Lee | Brown University |
| Han-Bo-Ram Lee | Incheon National University |
| Soo-Hyun Kim | Yeungnam University |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: -
Characteristic: Conformality, Step Coverage
Analysis: -
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Substrates
| SiO2 |
Notes
| 487 |