Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition

Type:
Journal
Info:
ECS Journal of Solid State Science and Technology, 3 (7) P253-P258 (2014)
Date:
2014-05-14

Author Information

Name Institution
Loïc AssaudAix-Marseille Université
Kristina PitzschelAix-Marseille Université
Margrit HanbückenAix-Marseille Université
Lionel SantinacciAix-Marseille Université

Films



Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Substrates

AAO, Anodic Aluminum Oxide
Si(100)

Notes

Ultratech Fiji thermal and PEALD TiN on high aspect ratio AAO substrates.
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