Publication Information

Title: Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications

Type: Journal

Info: J. Vac. Sci. Technol. B 27(2)., Mar/Apr 2009

Date: 2009-03-20

DOI: http://dx.doi.org/10.1116/1.3097856

Author Information

Name

Institution

State University of New York at Albany

State University of New York at Albany

State University of New York at Albany

Films

Deposition Temperature Range N/A

0-0-0

7664-41-7

0-0-0

1333-74-0

Deposition Temperature Range N/A

0-0-0

7664-41-7

Deposition Temperature Range N/A

0-0-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Compositional Depth Profiling

XPS, X-ray Photoelectron Spectroscopy

Thermo VG-Scientific theta probe

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Veeco Autoprobe CP

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

Hitachi S-4800 Field Emission Scanning Electron Microscope

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

Dynamitron linear particle accelerator

Microstructure

TEM, Transmission Electron Microscope

JEOL 2010F

Conformality, Step Coverage

TEM, Transmission Electron Microscope

JEOL 2010F

Barrier Characteristics

TVS, Triangle Voltage Sweep

Unknown

Resistivity, Sheet Resistance

Unknown

Unknown

Substrates

SiO2

Keywords

Diffusion Barrier

Copper Electroplating

Notes

115

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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