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Plasma Enhanced Atomic Layer Deposition of SiO2 Using Space-Divided Plasma System
Type:
Journal
Info:
Science of Advanced Materials, Volume 8, Number 4 2016, pp. 872-877
Date:
2016-04-01
Author Information
| Name | Institution |
|---|---|
| Hyuckjip Choi | Kwangwoon University |
| Han S. Uhm | Kwangwoon University |
| Gi-Chung Kwon | Kwangwoon University |
| Byungha Cho | Kwangwoon University |
| Jinhyuck Yoo | Kwangwoon University |
Films
Film/Plasma Properties
Characteristic: Wet Etch Resistance
Analysis: Wet Etch
Characteristic: Conformality, Step Coverage
Analysis: -
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Characteristic: Morphology, Roughness, Topography
Analysis: -
Substrates
Notes
| Used conference abstract for some additional info. |
| 891 |