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Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
Type:
Presentation
Info:
ALD 2012 Talk
Date:
2012-06-18
DOI:
No DOI
Author Information
| Name | Institution |
|---|---|
| Sang-Kyung Choi | Yeungnam University |
| Soo-Hyun Kim | Yeungnam University |
| Taehoon Cheon | Daegu Gyeongbuk Institute of Science & Technology |
Films
Plasma TiC
Plasma TiN
Film/Plasma Properties
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Diffusion Barrier Properties
Analysis: Anneal
Substrates
| Silicon |
Notes
| Samples annealed 700-1000C, 5e-6Torr, 30min. |
| 90 |