Publication Information

Title: Thermal and Plasma-Enhanced ALD of Ta and Ti Oxide Thin Films from Alkylamide Precursors

Type: Journal

Info: Electrochemical and Solid-State Letters, 9 (6) G191-G194 (2006)

Date: 2006-03-28

DOI: http://dx.doi.org/10.1149/1.2186427

Author Information

Name

Institution

Pohang University of Science and Technology (POSTECH)

Pohang University of Science and Technology (POSTECH)

Films

Plasma Ta2O5 using Custom

Deposition Temperature Range N/A

19824-59-0

7782-44-7

Thermal Ta2O5 using Custom

Deposition Temperature Range N/A

19824-59-0

7732-18-5

Plasma TiO2 using Custom

Deposition Temperature Range N/A

3275-24-9

7782-44-7

Thermal TiO2 using Custom

Deposition Temperature Range N/A

3275-24-9

7732-18-5

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

Ellipsometry

Rudolf AutoEL II

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

Unknown

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Unknown

Leakage Current

I-V, Current-Voltage Measurements

HP 4156B Semiconductor Parameter Analyzer

Substrates

Si(001)

Keywords

High-k Dielectric Thin Films

Notes

All substrates received HF dip. Substrates for electrical testing also received RCA clean.

Nice plot of plasma and thermal Ta2O5 GPC vs temperature showing minima at 200-250C and higher GPC at lower and higher temperatures.

79

Disclaimer

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