Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 34, 031502 (2016)
Date:
2016-02-16

Author Information

Name Institution
Inhye LeeHanyang University
Jingyu ParkHanyang University
Heeyoung JeonHanyang University
Hyunjung KimHanyang University
Changhee ShinHanyang University
Seokyoon ShinHanyang University
Kunyoung LeeHanyang University
Hyeongtag JeonHanyang University

Films

Plasma Ru


Plasma Ni


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Substrates

Si(100)

Notes

775