Publication Information

Title: Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier

Type: Journal

Info: J. Vac. Sci. Technol. A 33(5), Sep/Oct 2015

Date: 2015-06-15

DOI: http://dx.doi.org/10.1116/1.4922936

Author Information

Name

Institution

Hanyang University

Hanyang University

Hanyang University

Hanyang University

Hanyang University

POSCO

Films

Plasma WCN using Unknown

Deposition Temperature Range = 250-450C

0-0-0

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

PHI 680 FEAES

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Rigaku D/Max-2500

Diffusion Barrier Properties

XRD, X-Ray Diffraction

Rigaku D/Max-2500

Thickness

XRR, X-Ray Reflectivity

Rigaku ATX-G

Resistivity, Sheet Resistance

Four-point Probe

Jandel

Substrates

SiO2

Keywords

Diffusion Barrier

Interconnect

Notes

PEALD WNC for Cu interconnect diffusion barrier.

314

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