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Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
Type:
Journal
Info:
J. Vac. Sci. Technol. A 33(5), Sep/Oct 2015
Date:
2015-06-15
Author Information
| Name | Institution |
|---|---|
| Hyunjung Kim | Hanyang University |
| Jingyu Park | Hanyang University |
| Heeyoung Jeon | Hanyang University |
| Woochool Jang | Hanyang University |
| Hyeongtag Jeon | Hanyang University |
| Junhan Yuh | POSCO |
Films
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Diffusion Barrier Properties
Analysis: XRD, X-Ray Diffraction
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
Notes
| PEALD WNC for Cu interconnect diffusion barrier. |
| 314 |